Dynatex dx-ii scribed wafer break tool - tested

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Subject: Dynatex dx-ii scribed wafer break tool - tested
DYNATEX DX-II Wafer Breaker system.
Breaks as small as 5 mil (125 um) cube with any type of metalization.
Process all length to width ratios and all sizes up to ~3.5" diameter.
Fully tested and working. Easy to maintain.